OH IC Open House

Introduction

The FHWA HMA density – Intelligent Compaction (IC) research team cordially invites you to attend an Open House that showcases asphalt IC technologies. The Open House is hosted by Ohio DOT.

Intelligent Compaction (IC) is an equipment-based technology for better quality control that results in longer pavement lives. IC machines are vibratory rollers with accelerometers mounted on the axle of drums, global positioning system, infrared temperature sensors (for asphalt), and on-board computers that can display color-coded maps in real-time to track roller passes, asphalt surface temperatures, and stiffness of compacted materials.

The FHWA has been leading a national effort to advance the IC technology through numerous projects since 2008 to improve compaction quality of materials that include granular soils, cohesive soils, stabilized base, and asphalt pavements.  To further accelerate the implementation of IC, FHWA is conducting IC demonstrations and open house events around the country.

Purpose

The objectives of this open house are:

  • Familiarize attendees with asphalt intelligent compaction technologies

  • Demonstrate the route to successful IC implementation

  • Demonstrate IC equipment

Target Audience

  • DOT Construction Engineers, QC/QA Personnel,  Spec Writers

  • Asphalt Paving Managers, Superintendent, QC Personnel

  • IC Roller Vendors and dealers

  • GPS Vendors

Presenters

The Open House presenters include:

  • Megan O’Callaghan, ODOT

  • Victor (Lee) Gallivan, FHWA HIPT, COTR of the FHWA HMA Density-IC research project

  • George Chang, Transtec Group, PI of the FHWA HMA Density-IC research project

  • Tim Kowalski, HAMM/Wirtgen

  • Ed Conlin, Sakai America

  • John Filby, SITECH-Ohio

  • Pete Kaz, Trimble

  • Jan Mennink, TopCon

  • Garry Acken, Kessler ENgineer

Agenda

TimeTopicSpeakerLength (min)
08:00 amCheck in 10
08:10 am

Welcome and Introduction


O’Callaghan10
08:20 amOverview to FHWA HMA Density-IC StudyGallivan20
08:40 amIntroduction to Intelligent CompactionChang30
09:10 amHAMM IC SystemKowalski30
09:40 amBreak 10
09:50 amSakai IC SystemConlin30
10:20 amTrimble GPS for ICFilby/Pete25
10:45 amTopCon GPS for ICMennink25
11:10 amLWD for AsphaltAcken20
11:30 amEquipment Demo (IC, GPS, LWD-a)VendorsDCP, MIT, and LWD 60
12:30 pmAdjourn  

Contacts

Craig Landefeld, ODOT, (614) 644-6622, Craig.landefeld@dot.state.oh.us